收藏本站
Multilayer Ceramic Chip Capacitors
Surface Mounting Information
Soldering Method
1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature
difference (Delta T) to within 130 degree Celsius.
2) The product size 1.6 × 0.8mm to 3.2 × 1.6mm can be used in reflow and wave soldering, and the product size of bigger than 3.2 × 1.6mm, or
smaller than 1.6 × 0.8mm, and capacitor arrays can be used in reflow.
Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution.
3) Please see our recommended soldering conditions.
4) In case of using Sn-Zn Solder, please contact us in advance.
5) The following condition is recommended for spot heater application.
? Recommended spot heater condition
Item
Distance
Angle
Projection Temp.
Flow rate
Nozzle diameter
Application time
Condition
5mm min.
45 °
400 ° C max.
Set at the minimum
2 φ to 4 φ (Single hole type)
10 sec. max. (1206 and smaller)
30 sec.max. (1210 and larger)
How to point spot heater
Single hole nozzle
Angle 45 °
Recommended Temperature Profile (Sn?3Ag?0.5Cu)
Reflow
250°C ± 5°C
5 to 10 sec. max.
Recommended Temperature Profile (62Sn Solder)
Reflow
Peak temperature
230°C ± 5°C
15 seconds maximum
300
250
Preheat
300
250
Preheat
Cool at normal room
temperature after
removing from
200
150
1 to 3°C/ sec.
170 to 180°C
200
150
Δ T
furnace.
100
220°C max.
100
More than180°C,
50
0
90 sec. max.
50
0
40 seconds maximum
90 ± 30 sec.
60 seconds
60 seconds
① Minimize soldering time.
② Ensure that allowable temperature difference does not exceed 150°C.
③ Ensure that allowable temperature difference does not exceed 130°C for 3.2 × 2.5mm size or larger.
①
②
③
④
Minimize soldering time.
Ensure that the temperature difference ( Δ T) does not exceed 150°C.
Ensure that the temperature difference ( Δ T) does not exceed 130°C for 3.2 × 2.5mm size or larger.
MLCC can withstand the above reflow conditions up to 3 times.
Wave
Wave
300
Preheat
Peak Temperature
300
Preheat
Peak Temperature
250
245°C to 260°C
250
230°C to 260°C
200
Δ T
200
Δ T
150
100
Cool at normal
150
100
Cool at normal
50
0
60 to 120 sec.
5 sec. max.
room temperature
50
0
60 to 120 sec.
5 sec. max.
room temperature
①
②
③
④
Ensure that the chip capacitor is preheated adequately.
Ensure that the temperature difference ( Δ T) does not exceed 150°C.
Cool naturally after soldering.
Wave soldering is not applicable for chips with size of 3.2 × 2.5mm or larger of 1.0 × 0.5mm or smaller and capacitor arrays.
①
②
③
④
Ensure that the chip capacitor is preheated adequately.
Ensure that the temperature difference ( Δ T) does not exceed 150°C.
Cool naturally after soldering.
Wave soldering is not applicable for chips with size of 3.2 × 2.5mm or larger of 1.0 × 0.5mm or smaller and capacitor arrays.
Soldering iron
1) Temperature of iron chip
1206 and smaller 350 ° C max. 5) Cautions
1210 and larger 280 ° C max.
a) Pre?heating is necessary rapid heating must be avoided.
2) Wattage
3) Tip shape of soldering iron
4) Soldering Time
80W max.
φ 3.0mm max.
3 sec. max.
Delta T ≤ 150 ° C
b) Avoid direct touching to capacitors.
c) Avoid rapid cooling after soldering. Natural cooling is recommended.
? Consult as if it is difficult to keep the temperature 280 ° C max. for 1210 and larger MLCC’S.
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*
相关PDF资料
CM453232-680KL INDUCTOR CHIP 68UH 10% 1812 SMD
CMH322522-R82ML INDUCTOR 820NH 450MA SMD
CMR05F101JODR CAP MICA 100PF 500V 5% RADIAL
CR-1025/BN BATTERY LITHIUM COIN 3V 10MM
CR-1220/HFN BATTERY LITHIUM COIN 3V PC PINS
CR-123APA/1B BATT 3V LITH CAMERA - RETAIL PKG
CR-1612/BN BATTERY LITHIUM COIN 3V 16MM
CR-1616/F2N BATTERY LITHIUM COIN 3V W/TAB
相关代理商/技术参数
CM21X5R106K06AT 制造商:AVX Corporation 功能描述:MLCC 0805 X5R 10U 6.3V 10% 制造商:Kyocera 功能描述:6.3V 10uF }10% 2012
CM21X5R106K10AT 制造商:AVX Corporation 功能描述:MLCC 0805 X5R 10UF 10V +-10%
CM21X5R106K16AT 制造商:AVX Corporation 功能描述:MLCC 0805 X5R10U 16V 10% 制造商:KYOCERA Corporation 功能描述:
CM21X5R106M06AT 制造商:AVX Corporation 功能描述:CHIP CAPACITOR
CM21X5R225K06AT 制造商:AVX Corporation 功能描述:
CM21X5R225K10AT 制造商:AVX Corporation 功能描述:MLCC 0805 X5R 2.2uF 10% 10VDC
CM21X5R225K16AB 制造商:Kyocera 功能描述:16V 2.2uF }10% 2.0~1.2~1.25mm X5R +85 -55 2.0mm 1.2mm 1.25mm Cut Tape 制造商:Kyocera 功能描述:Cap Ceramic 2.2uF 16V X5R 10% SMD 0805 85°C Bulk
CM21X5R225K25AT 制造商:AVX Corporation 功能描述:MLCC 2.2UF X5R 25V 10% 0805